We have also taken a close look at our customer feedback logs and implemented several of the most requested features. Main highlights of this release include:
- Support for MCAD data exchange via STEP and IGES file formats. Both import of component STEP/IGES files and export of the resulting STEP Assembly is supported (requires L2 or higher).
- Extensive modifications to existing libraries to include pre-supplied STEP files for radial electrolytics, connectors and some other common parts.
- Support for multiple track editing operations and enhancements to track necking.
- Enhanced support for design re-use via sub-circuit binding on the Replicate command.
- Enhancement of print sets in ARES to allow paste and soldermask prints alongside copper layers.
- Addition of single layer options for keepout objects (ctx menu command on the keepout object).
- Significant rework of the PDF output to address various issues with the existing implementation. Also added SVG output.
- Addition of MSP430G2x variant set.
- Addition of PIC18F45K50 variant set.
- Addition of ILI9341 TFT LCD (SPI Mode Only) and associated Arduino Shield
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